C
chipleveladhe
This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications.
Website: https://www.deepmaterialcn.com/epoxy-underfill-chip-level-adhesives.html
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