O
owtempera
This series is a one-component heat-curing epoxy resin for low temperature curing with good adhesion to a wide range of materials in a very short period of time. Typical applications include memory cards, CCD/CMOS program sets. Particularly suitable for thermosensitive components where low curing temperatures are required.
Huizhou City, Guangdong，China
Website:
https://www.deepmaterialcn.com/low-temperature-curing-epoxy-adhesive-for-sensitive-devices-and-circuit-protection.html
https://www.youtube.com/channel/UCh3aSFhccTUiJS3mwQR5TDg/about
https://www.pinterest.com/owtemperaturecuring/
https://bbs.now.qq.com/home.php?mod=space&uid=2967070
https://www.flickr.com/people/196933281@N04/
https://www.tumblr.com/owtemperaturecuring
https://en.gravatar.com/owtemperaturecuring
https://talk.plesk.com/members/owtemperaturecuring.266816/#about
https://www.blogger.com/profile/09712484947862129512
https://www.behance.net/lowtemadhesiv